 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Technical Data Sheet High Power Infrared LED Features Small package with high efficiency Peak wavelength p=850nm Soldering methods: SMT Thermal resistance (junction to lead): 35/W. Pb free The product itself will remain within RoHS compliant version. HIR-A07/L183-P01 Descriptions HIR-A07/L183-P01 series is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic with flat top view lens. The device is spectrally matched with silicon photodiode, Phototransistor. Applications CCD Camera Night Vision Infrared applied system Materials Items Housing Encapsulating Resin Electrodes Die attach Chip Description Heat resistant polymer Clear silicone resin Ag plating copper alloy Silver paste AlGaAs Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 1 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions 0.25mm Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 2 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Absolute Maximum Ratings (Ta=25) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction temperature Power Dissipation @IF=700mA Symbol IF VR Topr Tstg Tj Pd Rating 700 5 -40 ~ +85 -40 ~ +85 125 1 Units mA V C W Note: We suggest that customer should add the heat sink with HIR-A07/L183-P01 to exclude the heat. Electro-Optical Characteristics (Ta=25) Parameter Total Radiated Power Radiant Intensity Peak Wavelength Spectral Bandwidth Forward Voltage Reverse Current Optical Rise Time Optical Fall Time View Angle Thermal resistance, junction to heat-sink Note. Symbol Po IE p VF IR Tr Tf 21/2 Rth j-L Condition IF=350mA IF=700mA IF=350mA IF=700mA IF=20mA IF=20mA IF=350mA IF=700mA VR=5V IF=20mA IF=20mA IF=20mA IF=700mA Min. 60 120 10 30 --1.0 1.2 -----Typ. 110 220 35 70 850 50 1.6 1.9 -11 7 125 35 Max. ------2.5 3.0 10 ----Units mW mW/sr nm nm V A ns ns deg /W 1. Radiometric measurement tolerance : 10% 2 .21/2 is the off axis angle from lamp centerline where the radiant intensity peak value. 3. Forward Voltage measurement tolerance : 0.1V http:\\www.everlight.com Prepared date03-29-2007 Rev 1 is 1/2 of the Everlight Electronics Co., Ltd. Device NoDTH-A07-278 Page: 3 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Ambient Temperature 900 800 700 600 500 400 300 200 100 0 20 40 60 80 100 120 Rthj-L=35/W Fig.2 Spectral Distribution 100 80 60 40 20 0 IF=20mA Ta=25 C 790 810 830 850 870 890 910 930 950 Fig.3 Peak Emission Wavelength Ambient Temperature Fig.4 Forward Current vs. Forward Voltage 3.0 2.8 900 875 2.6 2.4 2.2 850 825 800 -25 2.0 1.8 1.6 1.4 1.2 1.0 0 25 50 75 100 0 100 300 500 700 900 1000 Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 4 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Typical Electro-Optical Characteristics Curves Fig.5 Relative Radiant Intensity vs. Angular Displacement 0 1.0 0.9 0.8 10 20 30 40 50 60 70 80 R e la tiv e I n t e n s it y ( % ) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 90 Angle (degree) Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 5 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Precautions For Use 1.Over-current-proof Though HIR-A07/L183-P01 has conducted ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2.Thermal Management i. Because HIR-A07/L183-P01 is a high power dissipation device, special and sufficient consideration in thermal management design must be made to optimize the thermal performance. ii. Heat sink design is implemented in the device for an additional thermal connection. Since the device is capable of SMT process, tin must be spread both heat sink and solder pads areas to dissipate the heat. iii. A high thermal conductivity substrate, such as Aluminum or Copper plate etc, must be applied for external thermal management. It is strongly recommended that the outer heat sink or PCB dimension per LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on Aluminum. iv. Sspecial thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. v. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically. 3.Soldering Condition 1.Lead reflow soldering temperature profile 2.Reflow soldering should not be done more than two times. 3.While soldering, do not put stress on the LEDs during heating. 4.After soldering, do not warp the circuit boa Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 6 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 4.Soldering Iron 1.For prototype builds or small series production runs it is possible to place and solder the LED by hand. 2.Dispensing thermal conductive glue or grease on the substrates and follow its curing spec. Press LED housing to closely connect LED and substrate. 3.It is recommended to hand solder the leads with a solder tip temperature of 280C for less than 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. 4.Be careful because the damage of the product is often started at the time of the hand solder. 5.Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 6.Repairing Repair should not be done after the LEDs have been soldered. If unfortunately, repair is unavoidable. In addition to double-head soldering iron, hot plane must be used under external heat sink plate to liquefy tin between device heat sink and outer heat sink, shown as figure below. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Hot plane with temperature controller Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 7 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Tube Packing Specifications 1.Reel Dimensions Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is 0.1mm 2.Carrier Tape Dimensions: Loaded quantity 800 PCS per reel. Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is 0.1mm Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 8 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Reliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level90% LTPD10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes 22pcs 22pcs IRUx2 IeLx0.8 VFUx1.2 UUpper Specification Limit LLower Specification Limit Failure Judgement Criteria Ac/Re 1 REFLOW Soldering TEMP.2605 6Mins 10secs 15mins 300Cycles 2 Temperature Cycle H : +100 5mins L : -40 15mins 3 Thermal Shock H :+100 L :-10 4 High Temperature Storage 5 Low Temperature Storage 5mins 300Cycles 10secs 5mins 1000hrs 1000hrs 1000hrs 1000hrs 0/1 0/1 22pcs 0/1 TEMP.+100 TEMP.-40 22pcs 22pcs 22pcs 22pcs 0/1 0/1 0/1 0/1 6 DC Operating Life IF=700mA 7 High Temperature/ 85 / 85% R.H High Humidity Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 9 of 10 Prepared byJAINE TSAI HIR-A07/L183-P01 Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label Label Form Specification CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place RoHS HIR-A07/L183-P01 Notes 1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don't reproduce or cause anyone to reproduce them without EVERLIGHT's consent. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\www.everlight.com Everlight Electronics Co., Ltd. Device NoDTH-A07-278 http:\\www.everlight.com Prepared date03-29-2007 Rev 1 Page: 10 of 10 Prepared byJAINE TSAI |
Price & Availability of HIR-A07L183-P01
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |